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Jedec Tray Input Handler

Designed with high speed rotary concept which pick ICs directly from trays, vision inspection and electrical test before output into tape/reel with auto replace capability.

Handler Capabilities

Input: Jedec Tray, Waffle Tray
Output: Tape & Reel with auto replace, Waffle tray
Vision Systems: 2D, 3D, 5S, bottom pads, 6 sided, In-pocket. Micro-crack capable. Colour and mono camera. BGA Balls.
No. of Test Site: Up to 16 sites
Test Force (selectable): 0.3kg - 3kg, Extraforce available up to 9kg. Real time test force display.
Applicable Packages: WLCSP, QFN, QFP, BGA, SOIC & etc
UPH: Up to 30k depends on package type
Test Socket & Contactors: Kelvin Contact, Clamp Type, Flat Test (100 Ampere @ 1ms)
Handler-Tester Comm.: GPIB, TTL, RS232
Networking: SECS GEM, TCPIP
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