Features
| Wafer size: 12, 8 inches |
| Chuck: Room / High Temperature (Max 150 °C, +/- 1.5 °C) |
| Auto probe pin search and alignment |
| Top cassette loading |
| GPIB tester-handler communication: RS232, TTL |
| Auto probe pins cleaning |
| Wafer size: 8, 6 inches |
| Chuck: Room/ High Temperature (Max 150 °C, +/- 1.5 °C) |
| Auto probe pin search and alignment |
| Front cassette loading |
| GPIB tester-handler communication: RS232, TTL |
| Auto probe pins cleaning |
| Wafer size: 12, 8 inches |
| Chuck: Room / High Temperature (Max 150 °C, +/- 1.5 °C) |
| Auto probe pin search and alignment |
| Top cassette loading |
| GPIB tester-handler communication: RS232, TTL |
| Auto probe pins cleaning |